Roles and Responsibilities:
Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies. Duties include performing gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals and other microelectronic components. This position requires wirebonding onto small pad sizes down to 0.001" in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
This position will require the capability to troubleshoot defective hybrids circuit card assemblies by visually screening wirebonds or chip placement. Duties will also include installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies. It also requires the utilization of measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to assure that the unit conforms to specifications. Plans work sequence by assessing work in progress to schedule requirements. The position will also require collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.
Qualifications and Education Requirements:
Basic Required Qualifications:
• Experience in wirebonding and ribbon bonding (0.001" and 0.0007" wire and various sizes of ribbon)
• Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools
• Good dexterity and eye/hand coordination
• Experience in microelectronics assembly (chip and wire assembly)
• Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
• Ability to work in a diverse team environment; Good interpersonal, teaming and communication skills
• High School Diploma required
• Second Shift Hours 3:00pm to 1:30am
Desired Skills:
• Experience in hybrid assembly in accordance with Mil STD 883
• Experience wirebonding or ribbon bonding to ceramic or duroid substrates
• Experience using Westbond and Metcal bonding machines and Unitech welder.
• Experience in substrate and component attach, auto pick-and-place
• Experience operating auto or manual bonding equipment
• Familiarity working in an ESD and FOD controlled environment
• Experience in mechanical assembly processes of small electronic devices
• Experience working on military products in ISO 9001 / AS9100 controlled environments
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Preferred Skills:
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